X.PIN· @thexpin · X·· 41 分钟前AI 评分50
AI 导读
X.PIN 报道，Intel 和 Nvidia 视玻璃基板为下一代 AI 芯片封装的终极方案，而中国显示巨头 BOE 可能抢先其供应商落地。BOE 近期披露，其每月 1000 片晶圆的试验线已出货尺寸超过 100×100mm 的 24 层玻璃基板，全部通过客户可靠性测试。
正文 · 原文
Intel and Nvidia view glass substrates as the ultimate solution for next-generation AI chip packaging, but Chinese display giant BOE might beat their suppliers to market.
BOE recently revealed that its 1,000-wafer-per-month pilot line has already shipped 24-layer glass substrates measuring over 100 by 100 millimeters, all of which passed client reliability testing.
来源：X.PIN · x.com